CONTAINER, PACKAGING MEMBER, CONTAINER MANUFACTURING METHOD, PACKAGING MEMBER MANUFACTURING METHOD AND COMPOUND SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a container restricting any deterioration in electric characteristic of a semiconductor device manufactured through application of a compound semiconductor substrate after stored, and also to provide a packaging member, a method for manufacturing these elements, and a compound semiconductor substrate stored by these containers and packaging members.

SOLUTION: There are provided a container used for storing a compound semiconductor substrate in which an including amount of tin is 1 ppm or less, and a container used for storing the compound semiconductor substrate in which an including amount of silicon is 1 ppm or less. There is also provided a packaging member for use in storing the compound semiconductor substrate in which an including amount of tin is 1 ppm or less. Further, the present invention discloses a method for manufacturing the aforesaid containers, and the packaging member, and the compound semiconductor substrate stored by the aforesaid containers and the packaging member.

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