| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent defective insulation or short circuit due to contact between a bonding wire of an electronic component at a lower stage side and an electronic component at an upper stage side, in addition, to suppress exfoliation defect among electronic components or increase in the production cost. <P>SOLUTION: A stack semiconductor device 1 includes a first semiconductor element 5 adhered on a circuit board 2 via a first adhesive layer 6, and a second semiconductor element 8 adhered thereon using a second adhesive layer 9. The second adhesive layer 9 is formed, using the same material as that of the first adhesive layer 6, and has a double-layer structure. The second adhesive layer 9 in the double-layer structure has a first layer that is disposed at a side of the first semiconductor element 5 and softened or melted at a temperature in adhesion, and a second layer that is disposed at a side of the second semiconductor element 8 and holds a layer form at a temperature in adhesion. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
