| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition capable of being decreased in a curing time, while keeping preservability, capable of giving a cured product excellent in adhesion to a surface of a silicon chip, especially, to a photosensitive polyimide resin and a nitride film, and capable of being used as a sealing agent for a semiconductor device which does not cause defects even when a reflow temperature after moisture absorption is increased to 260-270°C from a conventional temperature of about 240°C, is not deteriorated even under a high-temperature and high-humidity condition for a pressure cooker test (120°C/2.1 atm), etc., and does not cause release, nor cracks, even when subjected to several hundred times or more of temperature cycling between 65°C and 150°C, and to provide the semiconductor device. <P>SOLUTION: This liquid epoxy resin composition contains (A) a liquid epoxy resin, (B) an aromatic amine-based curing agent, and (C) a microcapsule-type curing accelerator formed by subjecting an acid anhydride to micro-encapsulation as essential components. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
