| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor test device which simultaneously tests a plurality of the semiconductor elements, capable of realizing miniaturization and low-cost mass production. SOLUTION: A test program is received from a server 300, a test pattern signal and an expected value signal are formed, and these signals are transmitted to the semiconductor elements. The plurality of the pattern generation boards 230 receive the test pattern result signals from the semiconductor elements and are compared with the above expected value signal. A DUT board 210 has the plurality of the connectors for connecting the plurality of the sockets and the pattern generation boards 230. A backplane board 250 contains a communication interface part for connecting with the server 300, contains the plurality of the connectors for the connecting with the plurality of the pattern generation boards 230 and supports the plurality of the pattern generation boards 230 in a mechanism. A power supply part 270 supplies power supply to the backplane board 250 and supports the backplane board 250 in terms of the mechanism. COPYRIGHT: (C)2006,JPO&NCIPI
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