发明名称 Atomic layer deposited dielectric layers
摘要 An atomic layer deposited dielectric layer and a method of fabricating such a dielectric layer produce a reliable dielectric layer having an equivalent oxide thickness thinner than attainable using SiO<SUB>2</SUB>. Depositing a hafnium metal layer on a substrate surface by atomic layer deposition and depositing a hafnium oxide layer on the hafnium metal layer by atomic layer deposition form a hafnium oxide dielectric layer substantially free of silicon oxide. Dielectric layers containing atomic layer deposited hafnium oxide are thermodynamically stable such that the hafnium oxide will have minimal reactions with a silicon substrate or other structures during processing.
申请公布号 US2006001151(A1) 申请公布日期 2006.01.05
申请号 US20050213013 申请日期 2005.08.26
申请人 MICRON TECHNOLOGY, INC. 发明人 AHN KIE Y.;FORBES LEONARD
分类号 H01L23/12;C23C16/40;H01L;H01L21/02;H01L21/205;H01L21/28;H01L21/31;H01L21/314;H01L21/316;H01L21/336;H01L21/8242;H01L21/8244;H01L23/053;H01L29/51;H01L29/78 主分类号 H01L23/12
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