发明名称 |
IPS-LCD device having optical compensation films |
摘要 |
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead.
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申请公布号 |
US2006001816(A1) |
申请公布日期 |
2006.01.05 |
申请号 |
US20050173349 |
申请日期 |
2005.07.01 |
申请人 |
NEC LCD TECHNOLOGIES, LTD. |
发明人 |
NAGAI HIROSHI;IKENO HIDENORI |
分类号 |
G02F1/1343 |
主分类号 |
G02F1/1343 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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