| 摘要 |
<p>Disclosed is a method for manufacturing a multilayer electronic component comprising a step for forming an electrode layer (12a) on a first supporting sheet (20), a step for obtaining a green sheet (10a) having the electrode layer (12a) by forming a green sheet (10a) on the surface of the electrode layer (12a), a step for forming a green chip by arranging the green sheets (10a) in layers each of which green sheets (10a) has the electrode layer (12a), and a step for firing the green chip. Such a method for manufacturing a multilayer electronic component is characterized in that an adhesive layer (28) is formed on a surface of each green sheet (10a) on the side opposite to the electrode layer before arranging the green sheets (10a) in layers, and then the green sheets (10a) each having the electrode layer (12a) are arranged in layers via the adhesive layers (28).</p> |
