Wire saw for separating semiconductor wafers from a piece of crystal comprises a force measuring sensor arranged between a workpiece and a carriage

摘要

#CMT# #/CMT# Wire saw (2) comprises a force measuring sensor (7) arranged between a workpiece (4) and a carriage (3). #CMT# : #/CMT# Preferred Features: An actuator moves the workpiece in and against the direction of the movement of the carriage. A unit rotates the workpiece with a drive for operating the unit. A control unit controls the movement of the carriage, the wire feeding rollers (1) and the workpiece depending on the force determined by the sensor. An independent claim is also included for a process for separating semiconductor wafers from a piece of crystal. #CMT#USE : #/CMT# For separating semiconductor wafers from a piece of crystal. #CMT#ADVANTAGE : #/CMT# The wire saw is easy to use. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic view of the wire saw. 1 : wire feeding rollers 2 : wire saw 3 : carriage 4 : workpiece 7 : force measuring sensor.