| 发明名称 |
LAMINATE FOR IMPROVED BONDING |
| 摘要 |
<p>A laminate structure is provided that results in an improvement in bond performance over existing laminates for applications in which hot melt adhesive is used. The laminate structure includes an inorganic filler loaded into polyolefin to increase the heat transfer and bond strength of the hot melt adhesive to the laminate substrate at lower temperatures than polyolefin alone.</p> |
| 申请公布号 |
EP1483116(B1) |
申请公布日期 |
2006.01.04 |
| 申请号 |
EP20030744098 |
申请日期 |
2003.02.07 |
| 申请人 |
INTERNATIONAL PAPER COMPANY |
发明人 |
BUSHMAN, ALEXANDER, CRAIG;MARCHMAN, JAMES, IRVIN |
| 分类号 |
B32B27/32;B32B27/10;B32B27/20;B65D5/56;B65D65/40;D21H19/22;D21H19/58;D21H19/82;D21H19/84;D21H27/10 |
主分类号 |
B32B27/32 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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