Semiconductor device and assembling method thereof

摘要

A resin mold type semiconductor device (10) which can be prevented from occurring a crack and can be made thinner, is provided. A resin mold type semiconductor device comprises a semiconductor chip (11), a lead member (12) arranged in a manner that one side face (12a) of a head portion thereof touches a surface (11a) of the semiconductor chip, a wire (13) for electrically connecting the surface of the semiconductor chip and another side face of the lead member, an adhesive member (15) for adhering the one side face of the lead member and a peripheral face (11b) of the semiconductor chip, and a package (14) for molding the semiconductor chip, a part of the lead, the wire and the adhesive member by synthetic resin. In a further embodiment, the lead member is provided with a concave portion and in the one side face a groove extending from the concave portion to an end of the lead.