发明名称 |
DEVICE FOR GRIPPING A SEMICONDUCTOR PLATE THROUGH A TRANSFER OPENING, USING THE CLOSURE OF THE OPENING |
摘要 |
<p>A device ( 12 ) picks up at least one semi-conductor wafer ( 11 ) from a container ( 14 ) of wafers fitted on one side ( 15 ) of an aperture ( 13 ) in the transfer station ( 10 ) of a semi-conductor wafer processing plant. The device is on the opposite side ( 17 ) of the aperture and the pick-up is effected through it. The device incorporates a shutter ( 1 ) movable between open and closed positions. A wafer picking up means ( 2 ) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means ( 3 ) moves the picking up means ( 2 ) back and forth through the aperture ( 13 ).</p> |
申请公布号 |
EP1610927(A2) |
申请公布日期 |
2006.01.04 |
申请号 |
EP20030813172 |
申请日期 |
2003.12.12 |
申请人 |
RECIF |
发明人 |
LERO, CHRISTOPHE;ASTEGNO, PIERRE;GAUDON, ALAIN |
分类号 |
B23Q7/04;B23Q11/08;H01L21/677;H01L21/687;(IPC1-7):B23Q7/00 |
主分类号 |
B23Q7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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