发明名称 DEVICE FOR GRIPPING A SEMICONDUCTOR PLATE THROUGH A TRANSFER OPENING, USING THE CLOSURE OF THE OPENING
摘要 <p>A device ( 12 ) picks up at least one semi-conductor wafer ( 11 ) from a container ( 14 ) of wafers fitted on one side ( 15 ) of an aperture ( 13 ) in the transfer station ( 10 ) of a semi-conductor wafer processing plant. The device is on the opposite side ( 17 ) of the aperture and the pick-up is effected through it. The device incorporates a shutter ( 1 ) movable between open and closed positions. A wafer picking up means ( 2 ) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means ( 3 ) moves the picking up means ( 2 ) back and forth through the aperture ( 13 ).</p>
申请公布号 EP1610927(A2) 申请公布日期 2006.01.04
申请号 EP20030813172 申请日期 2003.12.12
申请人 RECIF 发明人 LERO, CHRISTOPHE;ASTEGNO, PIERRE;GAUDON, ALAIN
分类号 B23Q7/04;B23Q11/08;H01L21/677;H01L21/687;(IPC1-7):B23Q7/00 主分类号 B23Q7/04
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