发明名称 |
Molded wafer scale cap array |
摘要 |
An array of caps is taught for protecting features on a semiconductor wafer. The array is fabricated by a novel method in which a two part mold is used. The array is made from a layer of thermoplastic material which is placed in the mold. Each cap in the array has a central portion and a perimeter wall. The mold is opened so that the array is carried by the first half. The array is applied to a wafer using the first half. After the arrays are applied, the wafer is separated into individual chips.
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申请公布号 |
US6982189(B2) |
申请公布日期 |
2006.01.03 |
申请号 |
US20030728930 |
申请日期 |
2003.12.08 |
申请人 |
SILVERBROOK RESEARCH PTY LTD |
发明人 |
SILVERBROOK KIA |
分类号 |
H01L21/44;H01L23/02;B29C33/38;B29C33/40;B29C35/08;B29C43/36;B29C45/12;B81B7/00;H01L21/00;H01L21/48;H01L21/50;H01L21/8238;H01L23/10;H01L23/12 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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