发明名称 |
Thermal solution for electronic devices |
摘要 |
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
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申请公布号 |
US6982874(B2) |
申请公布日期 |
2006.01.03 |
申请号 |
US20030722364 |
申请日期 |
2003.11.25 |
申请人 |
ADVANCED ENERGY TECHNOLOGY INC. |
发明人 |
SMALC MARTIN DAVID;SHIVES GARY D.;REYNOLDS, III ROBERT ANDERSON |
分类号 |
H05K7/20;H05K9/00;G06F1/18;G06F1/20;H01L23/373;H01L23/552 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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