发明名称 |
Leadframe of a leadless flip-chip package and method for manufacturing the same |
摘要 |
A leadframe of a leadless flip-chip package includes a plurality of inner leads, a non-conductive ink layer and a solder mask layer. The inner leads have a plurality of bump-connecting terminals, a plurality of outer terminals and a plurality of redistribution lead portions. A half-etched recession is formed on lower surfaces of the redistribution lead portions, and is filled with the non-conductive ink layer. The non-conductive ink layer fixes the redistribution lead portions onto the bump-connecting terminals. The solder mask layer is easily formed on the non-conductive ink layer and covers the inner leads.
|
申请公布号 |
US2005287711(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20050147918 |
申请日期 |
2005.06.08 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
HUANG YAO-TING;CHANG CHIH-HUANG |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/31;H01L23/498;H01L25/065;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|