Stackable semiconductor module for electronics packaging has electronic component with vertical opening provided with continuous metallization with layer of soldering paste to connect it to contact of another electronic component

摘要

The module has an electronic component (1) with a semiconductor chip (2) enclosed in a plastic casing (3). The casing has a vertical opening (7,9) provided with continuous metallization (8,10). In the region nearby the top of vertical opening, a layer of soldering paste is provided which connects the metallization to the contact of another electronic component. Independent claims are also included for the following: (A) Electronic circuit with a stacked semiconductor module; and (B) Method for the manufacture of stacked semiconductor module.