| 摘要 |
<p>A semiconductor element in a semiconductor device is protected from the surrounding heat environment. The semiconductor device is provided with a supporting board (1) having a heat dissipating characteristic and electrical conductivity, and a main semiconductor element (2) firmly adhered on one main plane of the supporting board (1) through an insulating member (3). The insulating member (3) is provided with an insulating layer (3a) firmly adhered on the supporting board (1), and a heat insulating layer (3b) firmly adhered between the insulating layer (3a) and the main semiconductor element (2), and the main semiconductor element (2) is sufficiently protected from the surrounding heat environment.</p> |
