| 发明名称 |
Multi-chip semiconductor connector assembly method |
| 摘要 |
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die. |
| 申请公布号 |
US2005287703(A1) |
申请公布日期 |
2005.12.29 |
| 申请号 |
US20040877165 |
申请日期 |
2004.06.28 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC. |
发明人 |
CARNEY FRANCIS J.;CELAYA PHILLIP;FAUTY JOSEPH K.;LETTERMAN JAMES P.;GERMAIN STEPHEN S.;YODER JAY A. |
| 分类号 |
H01L21/58;H01L23/495;H01L25/07;(IPC1-7):H01L21/58 |
主分类号 |
H01L21/58 |
| 代理机构 |
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