发明名称 |
GERÄT ZUM FORMEN VON KUNSTSTOFFVERPACKUNGEN |
摘要 |
The present invention has a top mold, cavity plate and bottom mold for encapsulating a variety of BGA packages using a transfer molding process. The top mold features a network of runner for communicating with at least one spruce. The cavity plate has on the side facing the bottom mold at least one cavity for forming a mold over a substrate sandwiched there between when clamped. On the side of the cavity plate facing the top mold is at least one conical channel for receiving resin from the runner. The tip of the conical channel terminates in a submarine gate disposed in the centre of the cavity for introducing resin therein while minimising wire sweep. The network of runner and combination of conical channels encapsulates BGA packages in a variety of matrix reliably and economically. |
申请公布号 |
DE69828163(T2) |
申请公布日期 |
2005.12.29 |
申请号 |
DE1998628163T |
申请日期 |
1998.05.02 |
申请人 |
ADVANCED SYSTEMS AUTOMATION LTD., SINGAPORE |
发明人 |
CHEW, SENG;TAN, HUI |
分类号 |
B29C45/26;B29C45/02;B29C45/14;H01L21/56 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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