发明名称 |
Methods of forming conductive interconnects, and methods of depositing nickel |
摘要 |
The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which contains triethanolamine, maleic anhydride and at least one nickel salt.
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申请公布号 |
US2005287305(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20050149578 |
申请日期 |
2005.06.09 |
申请人 |
TIWARI CHANDRA |
发明人 |
TIWARI CHANDRA |
分类号 |
B05D1/18;C23C18/16;C23C18/32;H01L21/288;H01L21/44;H01L21/768;(IPC1-7):B05D1/18 |
主分类号 |
B05D1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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