发明名称 Capillary for wire bonding
摘要 A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.
申请公布号 US2005284913(A1) 申请公布日期 2005.12.29
申请号 US20040877079 申请日期 2004.06.24
申请人 ASM TECHNOLOGY SINGAPORE PTE LTD. 发明人 LIM LOON A.;VATH CHARLES J.III
分类号 B23K20/00;B23K37/00;(IPC1-7):B23K37/00 主分类号 B23K20/00
代理机构 代理人
主权项
地址