发明名称 |
Capillary for wire bonding |
摘要 |
A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.
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申请公布号 |
US2005284913(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20040877079 |
申请日期 |
2004.06.24 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD. |
发明人 |
LIM LOON A.;VATH CHARLES J.III |
分类号 |
B23K20/00;B23K37/00;(IPC1-7):B23K37/00 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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