发明名称 |
Microelectronic devices and methods for forming interconnects in microelectronic devices |
摘要 |
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.
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申请公布号 |
US2005287783(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20040879838 |
申请日期 |
2004.06.29 |
申请人 |
KIRBY KYLE K;AKRAM SALMAN;HEMBREE DAVID R;RIGG SIDNEY B;FARNWORTH WARREN M;HIATT WILLIAM M |
发明人 |
KIRBY KYLE K.;AKRAM SALMAN;HEMBREE DAVID R.;RIGG SIDNEY B.;FARNWORTH WARREN M.;HIATT WILLIAM M. |
分类号 |
H01L21/44;H01L21/4763;H01L21/768;H01L23/48;H01L23/52;H01L29/40;H05K1/03;H05K3/40;H05K3/42;(IPC1-7):H01L21/44;H01L21/476 |
主分类号 |
H01L21/44 |
代理机构 |
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主权项 |
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