| 摘要 |
Method and apparatus for testing a plurality of devices on a device wafer. One embodiment provides a test circuitry wafer having a first surface and a second surface, the test circuitry wafer comprising a plurality of contact pads disposed on the first surface for contacting a plurality of device pads on the device wafer, a plurality of interface pads disposed on the second surface for contacting probe needles on a probe card and one or more test features disposed in the test circuitry wafer, wherein the one or more test features are electrically connected to at least one of the contact pads and the interface pads.
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