| 摘要 |
Disclosed is a method of fabricating a double-sided PCB without via holes, functioning to transport electric signals between both sides of the PCB, by folding a flexible substrate, in which circuit patterns are formed on only one side of the flexible substrate, and the double-sided PCB without the via holes fabricated by the method. Therefore, the method is advantageous in that it allows PCB manufacturers to save the efforts for forming and protecting the via holes because the double-sided PCB does not need via holes, and reduces its fabricating cost and time, due to simplicity of this method.
|
