Process for manufacture of semiconductor chips utilizing a posteriori corrections to machine control system and settings

摘要

Methods and apparatus utilizing a posteriori adjustments to a projection imaging machine used in manufacturing of semiconductor integrated circuits are described. Measurements of degradation in a lithography processing of a projection imaging tool or machine are provided. The operation of the projection imaging tool is adjusted in response to the measurements. The projection imaging machine or tool can be adjusted in a single adjustment, or in a series of sub-adjustments. Likewise, only a single machine may be adjusted, or multiple machines used in the manufacture of semiconductor integrated circuits may be adjusted. The measurements may be made using in-situ metrology tests. A database including historical and current machine states may be utilized in determining degradation of the lithography processing.