发明名称 |
Ultra thin dual chip image sensor package structure and method for fabrication |
摘要 |
A thin stacked image sensor package containing an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.
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申请公布号 |
US2005285239(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20040881058 |
申请日期 |
2004.06.29 |
申请人 |
TSAI CHEN J;LIN CHIH-WEN |
发明人 |
TSAI CHEN J.;LIN CHIH-WEN |
分类号 |
H01L21/44;H01L23/495;H01L27/146;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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