发明名称 |
Apparatus and method for indexing of substrates and lead frames |
摘要 |
An apparatus for manipulating a work piece in connection with a wire bonding machine including at least one magazine handler is provided. The apparatus includes a first conveyor system configured to receive work pieces from the at least one magazine handler, and a second conveyor system configured to receive work pieces from the at least one magazine handler. The apparatus is adapted such that the second conveyor system prepares a work piece for a wire bonding operation by a wire bonding tool concurrent with the first conveyor system supporting another work piece during a wire bonding operation of the another work piece using the wire bonding tool.
|
申请公布号 |
US2005284915(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20050152130 |
申请日期 |
2005.06.14 |
申请人 |
BEATSON DAVID T;SADLER RICHARD D;AZIZ MOHAMAD Y;SINHAROY ARINDAM |
发明人 |
BEATSON DAVID T.;SADLER RICHARD D.;AZIZ MOHAMAD Y.;SINHAROY ARINDAM |
分类号 |
B23K20/00;B23K31/02;B23K37/00;H01L21/00;(IPC1-7):B23K37/00 |
主分类号 |
B23K20/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|