SYSTEM AND METHOD FOR CARRYING OUT LIQUID AND SUBSEQUENT DRYING TREATMENTS ON ONE OR MORE WAFERS
摘要
Systems for processing microelectronic substrates in a process chamber that incorporate improved technology for transitioning from a wet process to a dry process (especially transitioning from rinsing to drying). At least a portion of residual liquid remaining in fluid supply lines after a wet treatment is removed via a pathway that avoids purging directly onto the substrates. Related methods are also included in the present invention.
申请公布号
WO2005123281(A2)
申请公布日期
2005.12.29
申请号
WO2005US18615
申请日期
2005.05.25
申请人
FSI INTERNATIONAL, INC.;BENSON, ARNE, C.;OLSON, ERIK, D.;SPAETH, DOUGLAS, S.
发明人
BENSON, ARNE, C.;OLSON, ERIK, D.;SPAETH, DOUGLAS, S.