发明名称 THERMOELECTRIC CONVERSION MODULE
摘要 <p>A thermoelectric conversion module comprising an inexpensive good thermal conductivity substrate in which electric insulation is secured between the good thermal conductivity substrate and an electrode. A thermoelectric conversion element consists of a P type semiconductor (1) and an N type semiconductor (2) connected in a shape of pi. Electrodes (3-5) are connected with the both end faces of the thermoelectric conversion element. Good thermal conductivity substrates (8, 9) abut against the electrodes (3-5). The good thermal conductivity substrates (8, 9) are composed of aluminium or an aluminium alloy and an anodic oxidation film (10) is provided between the good thermal conductivity substrates (8, 9) and the electrodes (3-5). The thermoelectric conversion module (20) comprises the good thermal conductivity substrates (8, 9) composed of inexpensive aluminium or aluminium alloy and can secure electric insulation between the anodic oxidation film (10) and the good thermal conductivity substrate.</p>
申请公布号 WO2005124882(A1) 申请公布日期 2005.12.29
申请号 WO2005JP09577 申请日期 2005.05.25
申请人 TAKAHASHI, KOH;ARUZE CORP. 发明人 TAKAHASHI, KOH
分类号 H01L35/32;H01L35/30;H02N11/00;(IPC1-7):H01L35/32 主分类号 H01L35/32
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