| 发明名称 |
Conductive polishing article for electrochemical mechanical polishing |
| 摘要 |
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
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| 申请公布号 |
US2005284770(A1) |
申请公布日期 |
2005.12.29 |
| 申请号 |
US20050215254 |
申请日期 |
2005.08.30 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BUTTERFIELD PAUL D.;CHEN LIANG-YUH;HU YONQI;MANENS ANTOINE P.;MAVLIEV RASHID;TSAI STAN D.;LIU FENG Q.;WADENSWEILER RALPH;SUN LIZHONG;NEO SIEW S.;DUBOUST ALAIN |
| 分类号 |
B23H5/00;B23H5/06;B23H5/08;B23H5/10;B24B37/04;B24B49/16;B24B53/007;B24D13/14;C25D17/00;C25D17/10;H01L21/321;(IPC1-7):B23H5/00 |
主分类号 |
B23H5/00 |
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