发明名称 |
Lids for wafer-scale optoelectronic packages |
摘要 |
A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.
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申请公布号 |
US2005285131(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20050097534 |
申请日期 |
2005.03.31 |
申请人 |
GALLUP KENDRA J;MATTHEWS JAMES A;JOHNSON MARTHA |
发明人 |
GALLUP KENDRA J.;MATTHEWS JAMES A.;JOHNSON MARTHA |
分类号 |
G02B6/42;H01L21/00;H01L23/02;H01L33/48;H01S5/022;H01S5/026;(IPC1-7):H01L21/00;H01L33/00 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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