发明名称 Method and system for an interchangeable headset module resistant to moisture infiltration
摘要 A headset assembly includes a moisture-proof and temperature resistant headset module. The headset module is sealed against moisture and is constructed from materials that are durable and can withstand constant use, physical abuse, and rapid swings in temperature and other environmental conditions. Furthermore, the headset module is interchangeable with a variety of headset frames so as to provide comfort during prolonged use and in high ambient noise environments.
申请公布号 US2005286717(A1) 申请公布日期 2005.12.29
申请号 US20040874972 申请日期 2004.06.23
申请人 VOCOLLECT, INC. 发明人 VIDUYA ANDRES;ZATEZALO DOUGLAS M.
分类号 H04M1/00;H04M1/05;H04M1/18;H04M1/60;H04M9/00;(IPC1-7):H04M1/00 主分类号 H04M1/00
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