发明名称 Semiconductor storage device and method of manufacturing the same
摘要 A method of manufacturing a semiconductor storage device having a capacitive element having a dielectric layer having a perovskite-type crystal structure represented by general formula ABO<SUB>3 </SUB>and a lower electrode and an upper electrode disposed so as to sandwich the dielectric layer therebetween; in the method are carried out forming, on a lower electrode conductive layer, using a MOCVD method, an initial nucleus containing at least one metallic element the same as a metallic element in the dielectric layer, forming, on the initial nucleus, using a MOCVD method, a buffer layer containing at least one metallic element the same as the metallic element contained in both the initial nucleus and the dielectric layer, in a higher content than the content of this metallic element contained in the initial nucleus, and forming, on the buffer layer, using a MOCVD method, the dielectric layer having a perovskite-type crystal structure.
申请公布号 US2005287735(A1) 申请公布日期 2005.12.29
申请号 US20050202032 申请日期 2005.08.12
申请人 NEC ELECTRONICS CORPORATION 发明人 NAKAGAWA TAKASHI;HASE TAKASHI
分类号 C23C16/30;H01L21/00;H01L21/02;H01L21/316;H01L21/8234;H01L21/8242;H01L21/8244;H01L21/8246;H01L27/105;H01L29/76;(IPC1-7):H01L21/823;H01L21/824 主分类号 C23C16/30
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