EQUIPMENT AND METHOD FOR ELECTROLYTIC DEPOSITION TREATMENT

摘要

Electrolytic deposition treatment equipment and method which can reduce metallic ion concentration of a treated liquid by electrolytic deposition to a level where the treated liquid can be discharged outside and can perform such treatment even when a quantity of wastewater generated by semiconductor manufacturing equipment is large. The electrolytic deposition treatment equipment is provided with a cathode (3) for depositing the metallic ion in water being treated as metal, a cation exchange film (4) arranged to face the cathode (3), and an anode (6) arranged to face the cation exchange film (4) through a cation exchange body (5). The water to be treated is supplied in a space between the cathode (3) and the cation exchange film (4).