| 发明名称 |
Circuit apparatus and method of manufacturing the same |
| 摘要 |
Circuit elements including a plurality of semiconductor devices and passive elements embedded in an insulating resin film are formed on a metal substrate having a surface roughness Ra of 0.3 to 10 mum. This produces an anchoring effect occurs between the substrate and the insulating film, thereby improving the adhesiveness between the substrate and the insulating resin film.
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| 申请公布号 |
US2005285147(A1) |
申请公布日期 |
2005.12.29 |
| 申请号 |
US20050168655 |
申请日期 |
2005.06.29 |
| 申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
USUI RYOSUKE;MIZUHARA HIDEKI;INOUE YASUNORI |
| 分类号 |
H01L21/02;H01L21/3205;H01L21/4763;H01L21/82;H01L23/14;H01L23/538;H01L27/01;H01L27/10;H01L29/739;H05K1/05;H05K1/16;H05K1/18;H05K3/38;H05K3/46;(IPC1-7):H01L21/82;H01L21/320;H01L21/476 |
主分类号 |
H01L21/02 |
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