发明名称 |
Method and apparatus for molding a semiconductor device |
摘要 |
A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device. |
申请公布号 |
US2005287236(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20040876922 |
申请日期 |
2004.06.25 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
HO SHU C.;KUAH TENG H.;ZHANG ZHI P.;LEE SHUAI G.;LI CHUN Y.;LIN YI |
分类号 |
A23G1/20;H01L21/56;(IPC1-7):A23G1/20 |
主分类号 |
A23G1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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