THERMAL HEAD AND MANUFACTURING METHOD THEREOF

摘要

A board (1) of a thermal head (A) is provided with a heat element (5), a common electrode (3) and a separate electrode (4) for carrying electricity to the heat element (5), and a double layer structure protecting layer (6) formed on the heat element (5) to cover at least the heat element. A second protecting layer (6B) constituting the upper layer of the protecting layer (6) has conductivity, and a first protecting layer (6A) constituting the lower layer of the protecting layer (6) has a thickness (t1) which is three times the thickness (t2) of the second protecting layer (6B) or more. The second protecting layer (6B) is formed by baking a crystallized glass within a range of a temperature 30°C lower than a softening temperature of the crystallized glass to a temperature 50°C higher than that of the crystallized glass.