发明名称 |
LASER BEAM MACHINING METHOD |
摘要 |
<p>A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut. <IMAGE></p> |
申请公布号 |
EP1609558(A1) |
申请公布日期 |
2005.12.28 |
申请号 |
EP20030712673 |
申请日期 |
2003.03.12 |
申请人 |
HAMAMATSU PHOTONICS K.K. |
发明人 |
FUKUYO, FUMITSUGU;FUKUMITSU, KENSHI;UCHIYAMA, NAOKI;WAKUDA, TOSHIMITSU;ATSUMI, KAZUHIRO;MURAMATSU, KENICHI |
分类号 |
B23K26/38;B23K26/18;B23K26/42;B28D1/22;B28D5/00;H01L21/301;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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