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发明名称
LEAD FRAME FOR SEMICONDUCTOR PACKAGE
摘要
申请公布号
KR20050121842(A)
申请公布日期
2005.12.28
申请号
KR20040046933
申请日期
2004.06.23
申请人
SAMSUNG TECHWIN CO., LTD.
发明人
PARK, SE CHUEL;SHIN, DONG IL;PAEK, SUNG KWAN
分类号
H01L23/48;(IPC1-7):H01L23/48
主分类号
H01L23/48
代理机构
代理人
主权项
地址
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