发明名称 |
Light-emitting semiconductor device and method of fabrication |
摘要 |
A low-resistance silicon baseplate ( 11 ) has formed thereon a buffer layer 12 in the form of an alternating lamination of AlN sublayers ( 12 a) and GaN sublayers ( 12 b). On this buffer layer there are formed an n-type semiconductor region ( 13 ) of gallium nitride, an active layer ( 14 ) of gallium indium nitride, and a p-type semiconductor region ( 15 ) of gallium nitride, in that order. An anode ( 17 ) is formed on the p-type semiconductor region ( 15 ), and a cathode ( 18 ) on the baseplate ( 11 ).
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申请公布号 |
US6979844(B2) |
申请公布日期 |
2005.12.27 |
申请号 |
US20030394687 |
申请日期 |
2003.03.21 |
申请人 |
SANKEN ELECTRIC CO., LTD. |
发明人 |
MOKU TETSUJI;OHTSUKA KOHJI;YANAGIHARA MASATAKA;KIKUCHI MASAAKI |
分类号 |
H01L33/00;H01L33/04;H01L33/32;(IPC1-7):H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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