| 发明名称 |
Semiconductor package, electronic circuit device, and mounting method of semiconductor device |
| 摘要 |
A semiconductor package has first and second surfaces and has a plurality of pedestals disposed on the first surface, for keeping a certain height of the semiconductor package after mounting. |
| 申请公布号 |
US6979781(B2) |
申请公布日期 |
2005.12.27 |
| 申请号 |
US20040882204 |
申请日期 |
2004.07.02 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
AOKI KENJI |
| 分类号 |
H01L23/28;H01L23/00;H01L23/12;H01L23/498;H05K3/30;H05K13/04;(IPC1-7):H01L23/28;H05K5/06 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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