发明名称 |
Slotted substrates and methods and systems for forming same |
摘要 |
Methods and systems for forming slots in a substrate that has opposing first and second surfaces. The method makes a laser cut through either the first or second surface of the substrate sufficient to form a first trench. Material is also removed through the other of the first and second surfaces effective to form, in combination with the laser cut, a slot. At least a portion of the slot passes entirely through the substrate, and the slot has an aspect ratio greater than or equal to 1.
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申请公布号 |
US6979797(B2) |
申请公布日期 |
2005.12.27 |
申请号 |
US20020061828 |
申请日期 |
2002.01.31 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
RIVAS RIO T.;BUSWELL SHEN;KHAVARI MEHRGAN;POLLARD JEFFREY R. |
分类号 |
B41J2/14;B41J2/16;(IPC1-7):B23K26/36 |
主分类号 |
B41J2/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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