| 发明名称 |
Method and system for inspecting a wafer |
| 摘要 |
A method for inspecting a wafer includes telecentrically illuminating, with a radiation source, a region of the wafer surface to be inspected. An image of wafer region is acquired using a camera. The wafer region is inspected using the acquired image.
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| 申请公布号 |
US2005280808(A1) |
申请公布日期 |
2005.12.22 |
| 申请号 |
US20050153646 |
申请日期 |
2005.06.15 |
| 申请人 |
LEICA MICROSYSTEMS SEMICONDUCTOR GMBH |
发明人 |
BACKHAUSS HENNING;KREH ALBERT |
| 分类号 |
G01N21/88;G01N21/95;G01N21/956;(IPC1-7):G01N21/88 |
主分类号 |
G01N21/88 |
| 代理机构 |
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代理人 |
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