发明名称 Semiconductor device having low interface state density and method for fabricating the same
摘要 The semiconductor device comprises an intermediate layer formed on a semiconductor substrate 6 , the intermediate layer 12 being formed of an oxide containing a first element which is either of a III group element and a V group element, an insulation film formed on the intermediate layer, the insulation film being formed of an oxide of a second element which is the other of the III group element and the V group element, and an electrode 16 formed on the insulation film. Because the intermediate layer of the oxide containing the first element is formed, even when the gate insulation film is formed of Al<SUB>2</SUB>O<SUB>3 </SUB>or others, the interface state density can be depressed to be low. Thus, the semiconductor device can have low interface state density and small flat band voltage shift even when Al<SUB>2</SUB>O<SUB>3</SUB>, etc. is used as a material of the insulation film.
申请公布号 US2005280006(A1) 申请公布日期 2005.12.22
申请号 US20050208548 申请日期 2005.08.23
申请人 FUJITSU LIMITED 发明人 TANIDA YOSHIAKI;SUGIYAMA YOSHIHIRO
分类号 H01L29/861;H01L21/28;H01L29/51;H01L29/78;(IPC1-7):H01L29/15 主分类号 H01L29/861
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