| 发明名称 |
Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device |
| 摘要 |
An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa.s at 25° C.
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| 申请公布号 |
US2005282924(A1) |
申请公布日期 |
2005.12.22 |
| 申请号 |
US20050138645 |
申请日期 |
2005.05.27 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
KATOGI SHIGEKI;SUTO HOKO;YUSA MASAMI |
| 分类号 |
C09J4/02;C09J4/06;H01L21/56;H01L21/60;H01R4/04;H05K3/30;H05K3/32;(IPC1-7):C08G2/00 |
主分类号 |
C09J4/02 |
| 代理机构 |
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