| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive connecting structure without providing a particular structure such as a bump, when a substrate is connected to an IC chip or the like. SOLUTION: A circuit 12 at least whose surface provided on a deformable first film-like substrate 13 is composed of any one of Cu, Ag, Ni, Sn, Au, and solder, and an electrode 22 in an opening portion composed of an insulating layer 23 having larger width than that of the circuit provided on a second substrate and smaller thickness than that of the film-like substrate 13, specifically the circuit 12 of a first substrate 13 and at least a part of the electrode 22, are come into contact with each other by a deformation of the circuit 12 of the first substrate 13 in the opening portion, and the first substrate 13 and the second substrate are fixed to each other by an adhesive 31. COPYRIGHT: (C)2006,JPO&NCIPI
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