| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board, capable of interconnecting wiring patterns on opposite surface sides of a core board with high reliability, by inserting a conductive component (metal column) into a through hole in the core substrate without causing inconveniences. SOLUTION: The method comprises a process of preparing a substrate 10 including semi-curing resin layers 14, 16; a process of forming a through hole 10x penetrating the substrate 10; a process of inserting a conductive component 20 into the through hole 10x; a process of curing the non-curing resin layers 14, 16, in a fluidized state thereof, to embed a gap between the through hole 10x and the conductive component 20 with a resin layer by heat-pressing the substrate 10; and a process of forming a wiring pattern 26 interconnected to the opposite surface sides of the substrate 10 via the conductive component 20. COPYRIGHT: (C)2006,JPO&NCIPI
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