发明名称 CONDUCTIVE BALL LOADING METHOD AND LOADING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide improved loading method and loading apparatus for performing a conductive ball with sufficient accuracy in an arranged body by a predetermined pattern. SOLUTION: The method for placing the ball in arranged body is performed by filling up with the ball for conductivity recess formed in whole surface by predetermined pattern of the arranged body at least. The method includes two or more linear members arranged in the state that an axial core is arranged mostly. The method also includes the step of relatively horizontally moving a transfer implement in which the linear member is arranged into the state, in which this contact is possible relatively to the whole surface of the arranged body with a level posture to the linear member to one surface of the arranged body as opposed to the ball supplied to the whole surface of the arranged body. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005353624(A) 申请公布日期 2005.12.22
申请号 JP20040169418 申请日期 2004.06.08
申请人 HITACHI METALS LTD 发明人 ITO MOTOMICHI
分类号 H05K3/34;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K3/34
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