| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board capable of setting the wiring pitch between a junction electrode and a semiconductor to the minimum of 50μm, and to provide its manufacturing method. SOLUTION: The manufacturing method is provided with a first process for forming a first copper wiring (2) by etching copper foil with a first resin layer (1); a second process for covering the surface of the first copper wiring (2) and the wiring with a second resin layer (3); and a third process for connecting the copper wiring of different layers, by forming a second copper wiring (4) and a via (9) by a subtractive process in the surface of the second resin layer (3). Moreover, the method has a fourth process for building up by repeating the second process and the third process; a fifth process for removing all or a part of the first resin layer (1) from the surface where the copper foil of the first resin layer (1) is not attached, until the first copper wiring (2) or the second resin layer (3) is exposed; and a sixth process for forming the plating (8) for junction to a semiconductor to the surface where the first copper wiring (2) is exposed. It is preferable that a first resin layer (1) may consist of polyimide, and that the second resin layer (3) and the like may consist of epoxy resin. COPYRIGHT: (C)2006,JPO&NCIPI |
