| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly heat-resistant polyamide-based crosslinked film at a low cost, which film dose not melt at a high temperature of 300°C and has proper rigidity and morphological stability while keeping excellent properties (strength, impact strength and chemical resistance) of the polyamide resin. SOLUTION: The heat-resistant polyamide-based film has≥0.5 MPa dynamic elasticity at 300°C and is obtained by crosslinking a film by electron beam irradiation, which film comprises a polyamide-based resin composition containing (A) an aliphatic polyamide resin, (B) an electron beam-curable crosslinking auxiliary, (C) a hindered phenol-based thermal stabilizer and (D) a crosslinking type polyolefin-based resin having a functional group reacting with a polyamide. COPYRIGHT: (C)2006,JPO&NCIPI
|
