发明名称 LASER BEAM BORING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam boring method, in particular, a laser beam boring method suitable for boring a tapered hole in which the outlet diameter is≤1/2 of the inlet diameter (hereinafter, referred to as R). <P>SOLUTION: Ultraviolet laser is used, in which the beam diameter (hereinafter, referred to as r) of gaussian distribution is 3/8 of R. The beam center is shifted from the position of a predetermined hole by the radius of about 1/6 of R, circling is performed with the hole position as a center, the beam center is shifted by the radius of (R-r)/2 from the position of the predetermined hole, circling is performed with the hole position as a center, the beam center is shifted from the predetermined hole position by the radius of about 1/20 of R, circling is performed with the hole position as a center, the beam center is shifted from the predetermined hole position by the radius of about 1/10 of R, circling is performed with the hole position as the center, and the hole is pierced by bursting at the predetermined hole position. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005349446(A) 申请公布日期 2005.12.22
申请号 JP20040174199 申请日期 2004.06.11
申请人 HITACHI VIA MECHANICS LTD 发明人 NISHIYAMA HIROMI;MICHIGAMI NORIO;SOTOZONO HIROSHIGE
分类号 B23K26/00;B23K26/08;B23K26/38;B23K101/42;B23K103/16;(IPC1-7):B23K26/00 主分类号 B23K26/00
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